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[文献書誌] T.Itoh,T.Suga: "Applicability of MEMS Probe Card To Wafer-Level Test" Proceedings of Inter PACK'99. (1999)
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[文献書誌] N.Hosoda,Y.Kyogoku,T.Suga: "Effect of the surface treatment on the room-temeperature bonding of Al to Si and SiO2" Journal of Materials Science. 33. 253-258 (1998)
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[文献書誌] N.Hosoda,T.Akatsu,J.A.Chu and T.Suga: "The effect of the surface roughness on room temperature bonding of metals to ceramics" Proceedings of 9th International Conference on Modem Materials & Technologies. (1999)
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[文献書誌] H.Takagi,R.Maeda,T.R.Chung,N.Hosoda and T.Suga: "Effect of Surface Roughness on Room-Temperature Wafer Bonding by Ar Beam Surface Activation" Jpn.J.Appl.Phys. 37. 4197-4203 (1998)
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[文献書誌] N.Hosoda and T.Suga: "Reversible Interconnection by Control of Interface Reactions" Eco Design '99:First International Symposium on Environmentally Conscious Design and Inverse Manufacturing. 1012-1015 (1999)
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[文献書誌] N.Hosoda and T.Suga: "Reversible Interconnection using Hydrogen storage alloy" Proc.Symp.Jpn Inst.Metals. 149 (1998)