2014 Fiscal Year Final Research Report
Development of stretchable and flexible thermoelectric conversion module by printing method
| Project/Area Number |
25810140
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| Research Category |
Grant-in-Aid for Young Scientists (B)
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| Allocation Type | Multi-year Fund |
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| Research Field |
Device related chemistry
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| Research Institution | Osaka University |
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Principal Investigator |
SUGAHARA Tohru 大阪大学, 産業科学研究所, 助教 (20622038)
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| Project Period (FY) |
2013-04-01 – 2015-03-31
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| Keywords | 熱電発電 / 実装材料 |
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| Outline of Final Research Achievements |
We have developed flexible TEG modules for applying to heat sources with the curved surface such as exhaust pipes using ICA packaging technology. The module concept is that a mass of small Bi-Te thermoelectric chips are tightly mounted on a thin film substrate and connected with flexible and stretchable ICAs by printing technique. Fabricated TEG modules with 250 p-n pairs of thermoelectric chips have been evaluated in detail.
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| Free Research Field |
材料工学
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