A new method of nondestructive strain measurement for electronic packages using x-ray images

Research Project

Project/Area Number	21560109
Research Category	Grant-in-Aid for Scientific Research (C)
Allocation Type	Single-year Grants
Section	一般
Research Field	Materials/Mechanics of materials
Research Institution	Fukuoka Industrial Technology Center
Principal Investigator	KOGANEMARU Masaaki 福岡県工業技術センター, 機械電子研究所, 専門研究員 (20416506)
Co-Investigator(Kenkyū-buntansha)	UCHINO Masakazu 福岡県工業技術センター, 機械電子研究所, 専門研究員 (30416507) ITOHIRA Keiichi 福岡県工業技術センター, 機械電子研究所, 主任技師 (90463497)
Co-Investigator(Renkei-kenkyūsha)	IKEDA Toru 京都大学, 工学研究科, 准教授 (40243894) MIYAZAKI Noriyuki 京都大学, 工学研究科, 教授 (10166150) ASANO Tanemasa 九州大学, システム情報科学研究科, 教授 (50126306)
Project Period (FY)	2009 – 2011
Project Status	Completed (Fiscal Year 2011)
Budget Amount *help	¥4,680,000 (Direct Cost: ¥3,600,000、Indirect Cost: ¥1,080,000) Fiscal Year 2011: ¥650,000 (Direct Cost: ¥500,000、Indirect Cost: ¥150,000) Fiscal Year 2010: ¥1,560,000 (Direct Cost: ¥1,200,000、Indirect Cost: ¥360,000) Fiscal Year 2009: ¥2,470,000 (Direct Cost: ¥1,900,000、Indirect Cost: ¥570,000)
Keywords	電子デバイス・機器 / エレクトロニクス実装 / 実験力学 / 機械材料・材料力学 / デバイス設計・製造プロセス
Research Abstract	A new method of nondestructive strain measurement for electronic packages ware developed. In this method, the strain in electronic packages was obtained by applying a sampling moire method to x-ray image. It was demonstrated that whole-field distribution of the strain in electronic packages can be obtained by this method.